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Yspring | Meet you at the 5th Shenzhen International Semiconductor Exhibition

2023-10-30 16:12:13

Exhibition Introduction

The theme of this exhibition is "Chip Opportunities • Smart Future", focusing on the entire semiconductor supply chain, showcasing the latest technologies and achievements in chip design and manufacturing, integrated circuits, packaging and testing, materials and equipment, 5G new applications, new displays and other fields upstream and downstream of the semiconductor industry chain, highlighting the development potential and strength of China's semiconductor industry. The 7th Shenzhen International Electronics and Industrial Intelligent Manufacturing Exhibition will be held concurrently with the exhibition, with a dual exhibition linkage to achieve complementary supply chain resources in the electronics industry and accelerate the integration of the electronics and semiconductor industries.


At this exhibition, Yspring will focus on the theme of "Creating Intelligent Life and Changing the Future with Technology", with the core of "Internet of Things", and showcase in four fields: gesture recognition, Macon MCU, photoelectric sensor, and touch IC. The product is widely used in various fields such as small household appliances, consumer electronics, mice, digital products, automotive electronics, medical instruments and measurement, industrial control, smart homes, and security. It achieves high sensitivity, low power consumption, good stability, strong anti-interference ability, and meets the diversified development needs of the market.



Exhibition Time

5月16日 9:00---16:30

5月17日 9:00---16:30

5月18日 9:00---14:00


Exhibition location

Shenzhen International Convention and Exhibition Center (Bao'an New Building)

Booth Number: Hall 16, 16A005




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Host organization

SEMIXPO Semiconductor

Participation method

Scan the code quickly to register and enter the venue free of charge



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Long press the image to recognize the QR code in the picture

Enter the registration page and fill in the information!



Yspring · Four Highlights


MCU+Strategy: Based on the complete set of MCU technology cores from McKinsey (MDT), the core architecture covers PIC, 8051, RISC-V, ARM, with MCU technology as the core, focusing on the development of MCU+touch, MCU+sensing, MCU+connectivity and other industries around the Internet of Things and human-computer interaction to solve problems


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Intelligent SOC: Targeting the AIOT field, we create a series of SOC intelligent module products based on independent core technologies such as AI gesture recognition control, touch control, gas sensing, IoT control, etc., and rely on our own packaging factory to ensure controllable quality


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Optoelectronic Sensor: Our self-developed photoelectric sensor based on high-speed photoelectric sensing technology is continuously updated and iterated. Our products are widely used in consumer electronics, security, smart home and other fields


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R&D first: Establish an IPD R&D system to achieve collaboration across multiple regions and projects nationwide, and provide one-stop integrated solutions for customized chip and module development


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Exhibition invitation letter


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Yspring cordially invites partners to visit our booth

More exciting activities, all at the booth site

May 16th to May 18th · Booth 16A005, Hall 16

Looking forward to your visit!



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